𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Novel nanospring interconnects for high-density applications

✍ Scribed by Lunyu Ma, ; Qi Zhu, ; Sitaraman, S.K.; Chua, C.; Fork, D.K.

Book ID: 126594087
Publisher: IEEE
Year: 2001
Weight: 739 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916604

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