𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Hierarchical Synthesis of Particulate Thermal Interface Materials

✍ Scribed by Kanuparthi, S.; Zhang, X.; Subbarayan, G.; Sammakia, B.; Gowda, A.; Tonapi, S.

Book ID: 126634643
Publisher: IEEE
Year: 2006
Weight: 649 KB
Category: Article
ISBN-13: 9781424402601
DOI: 10.1109/ISAPM.2006.1666034

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2006 11th International Symposium

[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Well-Aligned Carbon Nanotubes for Device and Assembly Applications

✍ Zhou, L.; Hess, D.; Wong, C.P. 📂 Article 📅 2006 🏛 IEEE ⚖ 626 KB

[IEEE 2006 11th International Symposium

[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Effects of Barrier Layer on Copper-to-Silicon Diffusion and Intermetallic Compound Formation in Copper Wire Bonding

✍ Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y 📂 Article 📅 2006 🏛 IEEE ⚖ 869 KB

[IEEE International Symposium on Advance

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Advanced composites and other advanced materials for electronic packaging thermal management

✍ Zweben, C. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 433 KB

[IEEE International Symposium on Advance

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - "Dry-to-the-touch" thermal grease

✍ Khatri, P.; Ziemski, J. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 442 KB

[IEEE International Symposium on Advance

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - RF electrical simulation of embedded capacitor

✍ Yang Rao, ; Jianmin Qu, ; Wong, C.P. 📂 Article 📅 2001 🏛 IEEE ⚖ 550 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Advances in ceramic packaging for power amplifiers

✍ Sigliano, R.E.; Gaughan, F.J. 📂 Article 📅 1998 🏛 IEEE ⚖ 220 KB