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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

✍ Scribed by Ricky Lee, S.-W.; Yan, C.C.; Chow, L.W.; Papageorge, M.

Book ID: 126608033
Publisher: IEEE
Year: 1997
Weight: 719 KB
Edition: 1997
Category: Article
ISBN-13: 9780780341579
DOI: 10.1109/EPTC.1997.723890

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