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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Measurement of thermally induced warpage of BGA packages/substrates using phase-stepping shadow moire

✍ Scribed by Wang, Y.Y.; Hassell, P.

Book ID: 118002349
Publisher: IEEE
Year: 1997
Weight: 595 KB
Edition: 1997
Volume: 0
Category: Article
ISBN-13: 9780780341579
DOI: 10.1109/eptc.1997.723923

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