[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Assembly issues in replacing a high cost hermetically sealed hybrid with a low cost non-hermetic assembly for prolonged use at 180°C

✍ Scribed by Whitehurst, J.

• Book ID: 126734247
• Publisher: IEEE
• Year: 1997
• Weight: 505 KB
• Edition: 1997
• Category: Article
• ISBN-13: 9780780341579
• DOI: 10.1109/EPTC.1997.723902