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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - The optimum thermal design of microchannel heat sinks

✍ Scribed by Zhimin, W.; Fah, C.K.

Book ID: 126727521
Publisher: IEEE
Year: 1997
Weight: 650 KB
Edition: 1997
Category: Article
ISBN-13: 9780780341579
DOI: 10.1109/EPTC.1997.723898

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