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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness

✍ Scribed by Schmidt, R.; Hosler, W.; Tilgner, R.

Book ID: 126766524
Publisher: IEEE
Year: 1997
Weight: 513 KB
Edition: 1997
Category: Article
ISBN-13: 9780780341579
DOI: 10.1109/EPTC.1997.723908

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