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A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages

✍ Scribed by Bahi Manoubi Auguste; Fremont Hélène; Landesman Jean-Pierre; Gentil Annabelle; Lecuyer Pascal


Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
489 KB
Volume
49
Category
Article
ISSN
0026-2714

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