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[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - An improved etchback planarization process using a super planarizing spin-on sacrificial layer

✍ Scribed by Ting, C.H.; Pai, P.-L.; Sobczack, Z.

Book ID: 126633967
Publisher: IEEE
Year: 1989
Weight: 94 KB
Category: Article
DOI: 10.1109/VMIC.1989.78045

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