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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene

✍ Scribed by Jenei, S.; Decoutere, S.; Winderickx, G.; Struyf, H.; Tokei, Z.; Vervoort, I.; Vos, I.; Jaenen, P.; Carbonell, L.; De Jaeger, B.; Donaton, R.A.; Vanhaelemeersch, S.; Maex, K.; Nauwelaers, B.

Book ID: 126645806
Publisher: IEEE
Year: 2001
Weight: 307 KB
Category: Article
DOI: 10.1109/IITC.2001.930031

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