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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric

✍ Scribed by Saito, K.; Kosugi, T.; Yagi, S.; Yamaguchi, C.; Kudo, K.; Yano, M.; Kumazaki, T.; Yaita, M.; Ishii, H.; Machida, K.; Kyuragi, H.

Book ID: 126748991
Publisher: IEEE
Year: 2000
Weight: 251 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854300

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