𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Novel post electroplating in-situ rapid annealing process for advanced copper interconnect application

✍ Scribed by Chen, M.; Ho Seon Shin, ; Cheung, R.; Morad, R.; Dordi, Y.; Rengarajan, S.; Tsai, S.

Book ID: 126701901
Publisher: IEEE
Year: 2000
Weight: 365 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854323

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - A grain size limitation inherent to electroplated copper films

✍ Brongersma, S.H.; Richard, E.; Vervoort, I.; Maex, K. 📂 Article 📅 2000 🏛 IEEE ⚖ 271 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - The investigation of galvanic corrosion in post-copper-CMP cleaning

✍ Chen, H.C.; Yang, M.S.; Wu, J.Y.; Wang, V. 📂 Article 📅 2000 🏛 IEEE ⚖ 447 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - A novel via blockage model and its implications

✍ Qiang Chen, ; Davis, J.A.; Payman Zarkesh-Ha, ; Meindl, J.D. 📂 Article 📅 2000 🏛 IEEE ⚖ 262 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Integration of copper and fluorosilicate glass for 0.18 μm interconnections

✍ Barth, E.P.; Ivers, T.H.; McLaughlin, P.S.; McDonald, A.; Levine, E.N.; Greco, S 📂 Article 📅 2000 🏛 IEEE ⚖ 352 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric

✍ Saito, K.; Kosugi, T.; Yagi, S.; Yamaguchi, C.; Kudo, K.; Yano, M.; Kumazaki, T. 📂 Article 📅 2000 🏛 IEEE ⚖ 251 KB

[IEEE IEEE 2000 International Interconne

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Process integration of CVD Cu as a seed layer for Cu electroplating and a plug-fill application

✍ Ki-Chul Park, ; Seung-Man Choi, ; Sun-Jung Lee, ; Kyu-Hwan Chang, ; Hyeon-Deok L 📂 Article 📅 2000 🏛 IEEE ⚖ 319 KB