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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Integration of copper and fluorosilicate glass for 0.18 μm interconnections

✍ Scribed by Barth, E.P.; Ivers, T.H.; McLaughlin, P.S.; McDonald, A.; Levine, E.N.; Greco, S.E.; Fitzsimmons, J.; Melville, I.; Spooner, T.; DeWan, C.; Chen, X.; Manger, D.; Nye, H.; McGahay, V.; Biery, G.A.; Goldblatt, R.D.; Chen, T.C.

Book ID: 126764677
Publisher: IEEE
Year: 2000
Weight: 352 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854330

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