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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - 0.42 μm contacted pitch dual damascene copper interconnect for 0.15 μm EDRAM using tapered via aligned to trench

✍ Scribed by Hattori, T.; Masuda, H.; Sato, H.; Matsuda, T.; Yamamoto, A.; Kato, Y.; Ogawa, S.; Ohsaki, A.; Ueda, T.

Book ID: 126751471
Publisher: IEEE
Year: 2000
Weight: 339 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854310

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