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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

✍ Scribed by Gayet, P.; Lair, C.; van den Vegt, E.

Book ID: 126745806
Publisher: IEEE
Year: 2000
Weight: 342 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854286

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