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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Ultra-low dielectric constant low density material (k=2.2) for Cu damascene

✍ Scribed by Cheng, Y.Y.; Chao, L.C.; Jang, S.M.; Yu, C.H.; Liang, M.S.

Book ID: 126638346
Publisher: IEEE
Year: 2000
Weight: 462 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854312

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