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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Process integration of CVD Cu as a seed layer for Cu electroplating and a plug-fill application

✍ Scribed by Ki-Chul Park, ; Seung-Man Choi, ; Sun-Jung Lee, ; Kyu-Hwan Chang, ; Hyeon-Deok Lee, ; Ho-Kyu Kang, ; Sang-In Lee,

Book ID: 126647124
Publisher: IEEE
Year: 2000
Weight: 319 KB
Category: Article
ISBN-13: 9780780363274
DOI: 10.1109/IITC.2000.854276

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