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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Post etch cleaning of dual damascene system integrating copper and SiLK/sup TM/

✍ Scribed by Louis, D.; Peyne, C.; Arvet, C.; Lajoinie, E.; Maloney, D.; Lee, S.

Book ID: 126762615
Publisher: IEEE
Year: 1999
Weight: 264 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787091

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