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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Material property characterization and integration issues for mesoporous silica

✍ Scribed by Ryan, E.T.; Huei-Min Ho, ; Wen-li Wu, ; Ho, P.S.; Gidley, D.W.; Drage, J.

Book ID: 126600554
Publisher: IEEE
Year: 1999
Weight: 445 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787117

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