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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Thermal impact and process diagnosis of copper chemical mechanical polish

✍ Scribed by Hung-Wen Chiou, ; Zong-Huei Lin, ; Liang-Hsuan Kuo, ; Shing-Yih Shih, ; Lai-Juh Chen, ; Chin Hsia,

Book ID: 126768335
Publisher: IEEE
Year: 1999
Weight: 337 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787085

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