𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Electromigration early failure distribution in submicron interconnects

✍ Scribed by Gall, M.; Ho, P.S.; Capasso, C.; Jawarani, D.; Hernandez, R.; Kawasaki, H.

Book ID: 126740179
Publisher: IEEE
Year: 1999
Weight: 289 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787141

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Interconnect-limited VLSI architecture

✍ Dally, W.J. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 334 KB

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - High frequency simulation and characterization of advanced copper interconnects

✍ Cregut, C.; Le Carval, G.; Chilo, J. 📂 Article 📅 1999 🏛 IEEE ⚖ 266 KB

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Analysis of interconnect delay for 0.18 μm technology and beyond

✍ Shien-Yang Wu, ; Boon-Khim Liew, ; Young, K.L.; Yu, C.H.; Sun, S.C. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 254 KB

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Step like degradation profile of electromigration of W-plug contact

✍ Guo Qiang, ; Lo Keng Foo, ; Zeng Xu, ; Neo Soh Ping, ; Yao Pei, ; Oh Chong Khiam 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 341 KB

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Material property characterization and integration issues for mesoporous silica

✍ Ryan, E.T.; Huei-Min Ho, ; Wen-li Wu, ; Ho, P.S.; Gidley, D.W.; Drage, J. 📂 Article 📅 1999 🏛 IEEE ⚖ 445 KB

[IEEE IEEE 1999 International Interconne

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Thermal impact and process diagnosis of copper chemical mechanical polish

✍ Hung-Wen Chiou, ; Zong-Huei Lin, ; Liang-Hsuan Kuo, ; Shing-Yih Shih, ; Lai-Juh 📂 Article 📅 1999 🏛 IEEE ⚖ 337 KB