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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - BLOκ/sup TM/-a low-κ dielectric barrier/etch stop film for copper damascene applications

✍ Scribed by Ping Xu, ; Kegang Huang, ; Patel, A.; Rathi, S.; Tang, B.; Ferguson, J.; Huang, J.; Ngai, C.; Loboda, M.

Book ID: 126742501
Publisher: IEEE
Year: 1999
Weight: 274 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787093

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