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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Overcoming sheet resistance effects to enable electroplating of copper onto seedless barrier films

✍ Scribed by Takahashi, K.M.

Book ID: 126723969
Publisher: IEEE
Year: 1999
Weight: 251 KB
Category: Article
ISBN-13: 9780780351745
DOI: 10.1109/IITC.1999.787144

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