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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Atomic layer deposition (ALD) of tantalum-based materials for zero thickness copper barrier applications

✍ Scribed by Eisenbraun, E.; van der Straten, O.; Yu Zhu, ; Dovidenko, K.; Kaloyeros, A.

Book ID: 121274451
Publisher: IEEE
Year: 2001
Weight: 243 KB
Category: Article
DOI: 10.1109/IITC.2001.930062

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