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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Barrier/seed layer requirements for copper interconnects

✍ Scribed by Wong, S.S.; Ryu, C.; Lee, H.; Loke, A.L.S.; Kwon, K.-W.; Bhattacharya, S.; Eaton, R.; Faust, R.; Mikkola, B.; Mucha, J.; Ormando, J.

Book ID: 126760785
Publisher: IEEE
Year: 1998
Weight: 668 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704764

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