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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - A new theory for CMP with soft pads

✍ Scribed by Shi, F.G.; Zhao, B.; Wang, S.-Q.

Book ID: 120262542
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 294 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704755

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