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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Low temperature processing of conformal TiN by ACVD (advanced chemical vapor deposition) for multilevel metallization in high density ULSI devices

✍ Scribed by Kang, S.B.; Chae, Y.S.; Yoon, M.Y.; Leem, H.S.; Park, C.S.; Lee, S.I.; Lee, M.Y.

Book ID: 121357080
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 369 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704763

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