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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Characterization of the Cu/barrier metal interface for copper interconnects

✍ Scribed by Nogami, T.; Romero, J.; Dubin, V.; Brown, D.; Adem, E.

Book ID: 126623382
Publisher: IEEE
Year: 1998
Tongue: English
Weight: 629 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704929

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