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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Development of low-k copper barrier films deposited by PE-CVD using HMDSO, N/sub 2/O and NH/sub 3/

✍ Scribed by Ishimaru, T.; Shioya, Y.; Ikakura, H.; Nozawa, M.; Nishimoto, Y.; Ohgawara, S.; Maeda, K.

Book ID: 126748992
Publisher: IEEE
Year: 2001
Weight: 280 KB
Category: Article
DOI: 10.1109/IITC.2001.930009

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