[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Low damage ashing using H/sub 2//He plasma for porous ultra low-k

✍ Scribed by Matsushita, A.; Ohashi, N.; Inukai, K.; Shin, H.J.; Sone, S.; Sudou, K.; Misawa, K.; Matsumoto, I.; Kobayashi, N.

• Book ID: 124169169
• Publisher: IEEE
• Year: 2003
• Weight: 194 KB
• Category: Article
• ISBN-13: 9780780377974
• DOI: 10.1109/IITC.2003.1219737