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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Low-resistivity PVD α-tantalum: phase formation and integration in ultra-low k dielectric/copper damascene structures

✍ Scribed by Donohue, H.; Gris, H.; Yeoh, J.C.; Buchanan, K.

Book ID
121653514
Publisher
IEEE
Year
2002
Tongue
English
Weight
200 KB
Category
Article
ISBN-13
9780780372160

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