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[IEEE 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (27 Nov.-1 Dec. 1995)] Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - A new interlayer dielectric (ILD) cracking mechanism in ceramic packaged multilayered CMOS devices

โœ Scribed by Yeoh Eng Hong, ; Chong Aik Kean, ; Tay, R.


Book ID
126652018
Publisher
IEEE
Year
1995
Weight
262 KB
Category
Article
ISBN-13
9780780327979

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