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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Simulation of the TSV-to-device coupling in 3D ICs for short-channel strained silicon transistors

✍ Scribed by Yeleswarapu, Krishnamurthy; Trivedi, Amit Ranjan; Mukhopadhyay, Saibal

Book ID: 125445108
Publisher: IEEE
Year: 2013
Weight: 711 KB
Category: Article
ISBN: 1479907057
DOI: 10.1109/epeps.2013.6703507

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