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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

✍ Scribed by Song, Eunseok; Koo, Kyoungchoul; Kim, Myunghoi; Pak, Jun So; Kim, Joungho

Book ID: 115525589
Publisher: IEEE
Year: 2011
Weight: 358 KB
Volume: 0
Category: Article
ISBN: 1424494001
DOI: 10.1109/epeps.2011.6100235

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