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[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Comparison of TSV-based PDN-design effects using various stacking topology methods

✍ Scribed by Charles, Gary; Franzon, Paul D.

Book ID: 120030192
Publisher: IEEE
Year: 2012
Weight: 399 KB
Category: Article
ISBN: 1467325376
DOI: 10.1109/EPEPS.2012.6457848

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