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[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Simulation and measurement correlation of random rough surface effects in interconnects

✍ Scribed by Ding, Ruihua; Braunisch, Henning; Tsang, Leung; Chang, Wenmo

Book ID: 120030193
Publisher: IEEE
Year: 2012
Weight: 475 KB
Category: Article
ISBN: 1467325376
DOI: 10.1109/EPEPS.2012.6457894

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