𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Skin effect modeling of interconnects using the Laguerre-FDTD scheme

✍ Scribed by Yi, Ming; Swaminathan, Madhavan; Qian, Zhiguo; Aydiner, Alaeddin

Book ID: 120030901
Publisher: IEEE
Year: 2012
Weight: 823 KB
Category: Article
ISBN: 1467325376
DOI: 10.1109/EPEPS.2012.6457885

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Ultra-high speed memory bus using microwave interconnects

✍ Aberle, James T.; Bensalem, Brahim 📂 Article 📅 2012 🏛 IEEE ⚖ 408 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - S-parameter based multimode signaling

✍ Yan, Zhuo; Won, Chanyoun; Franzon, Paul D.; Aygun, Kemal; Braunisch, Henning 📂 Article 📅 2012 🏛 IEEE ⚖ 517 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Simulation and measurement correlation of random rough surface effects in interconnects

✍ Ding, Ruihua; Braunisch, Henning; Tsang, Leung; Chang, Wenmo 📂 Article 📅 2012 🏛 IEEE ⚖ 475 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Comparison of TSV-based PDN-design effects using various stacking topology methods

✍ Charles, Gary; Franzon, Paul D. 📂 Article 📅 2012 🏛 IEEE ⚖ 399 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - A discussion of an analytical per-unit-length impedance matrix model

✍ Broyde, Frederic; Clavelier, Evelyne; De Zutter, Daniel; Vande Ginste, Dries 📂 Article 📅 2012 🏛 IEEE ⚖ 258 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Minimizing simultaneous switching noise at reduced power with power transmission lines for high-speed signaling

✍ Telikepalli, Satyanarayana; Swaminathan, Madhavan; Keezer, David 📂 Article 📅 2012 🏛 IEEE ⚖ 1011 KB