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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Temperature-dependent through-silicon via (TSV) model and noise coupling

✍ Scribed by Lee, Manho; Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo

Book ID: 120633854
Publisher: IEEE
Year: 2011
Weight: 378 KB
Category: Article
ISBN: 1424494001
DOI: 10.1109/EPEPS.2011.6100238

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