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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Temperature-dependent through-silicon via (TSV) model and noise coupling

โœ Scribed by Lee, Manho; Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo


Book ID
120633854
Publisher
IEEE
Year
2011
Weight
378 KB
Category
Article
ISBN
1424494001

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