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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-Droop and resonant noise in 3DIC

✍ Scribed by Charles, Gary; Franzon, Paul D.; Kim, Jaemin; Levin, Alex

Book ID: 120884327
Publisher: IEEE
Year: 2011
Weight: 481 KB
Category: Article
ISBN: 1424494001
DOI: 10.1109/EPEPS.2011.6100243

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