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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Through-silicon via (TSV) depletion effect

✍ Scribed by Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo

Book ID: 120633853
Publisher: IEEE
Year: 2011
Weight: 628 KB
Category: Article
ISBN: 1424494001
DOI: 10.1109/EPEPS.2011.6100198

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