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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - A de-embedding method for extracting S-parameters of vertical interconnect in advanced packaging

✍ Scribed by Chang, Yin-Cheng; Hsu, Shawn S. H.; Chang, Da-Chiang; Lee, Jeng-Hung; Lin, Shuw-Guann; Juang, Ying-Zong

Book ID: 120656001
Publisher: IEEE
Year: 2011
Weight: 896 KB
Category: Article
ISBN: 1424494001
DOI: 10.1109/EPEPS.2011.6100231

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