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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Design and fabrication of geometrically complicated multiband microwave devices using a novel integrated 3D printing technique

✍ Scribed by Ahmadloo, Majid

Book ID: 121486414
Publisher: IEEE
Year: 2013
Weight: 240 KB
Category: Article
ISBN: 1479907057
DOI: 10.1109/EPEPS.2013.6703460

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