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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Insertion loss characterization of tightly spaced interconnects with an embedded patterned layer

✍ Scribed by Vargas, Marcos A.; Melde, Kathleen L.

Book ID: 126669202
Publisher: IEEE
Year: 2013
Weight: 944 KB
Category: Article
ISBN: 1479907057
DOI: 10.1109/EPEPS.2013.6703458

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