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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Insertion loss characterization of tightly spaced interconnects with an embedded patterned layer

โœ Scribed by Vargas, Marcos A.; Melde, Kathleen L.


Book ID
126669202
Publisher
IEEE
Year
2013
Weight
944 KB
Category
Article
ISBN
1479907057

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