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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Process considerations of TC-NCP fine-pitch copper pillar FC bonding

✍ Scribed by Cheung, Y.M.; Ka San Lam, ; Mak, Giuseppe Y.; Dewen Tian, ; Ming Li,

Book ID: 126760732
Publisher: IEEE
Year: 2012
Weight: 688 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507900

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