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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Preparation of copper nanoparticles with low sintering temperature

✍ Scribed by Deng, Dunying; Jin, Yunxia; Chen, Yuanrong; Qi, Tianke; Xiao, Fei

Book ID: 126753929
Publisher: IEEE
Year: 2012
Weight: 531 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507927

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