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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Effect of chemical etching solution on Cu/Al IMC result

✍ Scribed by Wong Boh Kid, ; Yap Jia Lin, ; Eu Poh Leng, ; Yow Kai Yun, ; Yong, C.C.

Book ID: 126748107
Publisher: IEEE
Year: 2012
Weight: 467 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507929

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