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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - The role of thermal properties of PCB substrates in heat dissipation of LED back light bars

✍ Scribed by Tang, C. Y.; Huang, J. J.; Peng, Y. L.; Tsai, M. Y.; Liang, Peter

Book ID: 126731270
Publisher: IEEE
Year: 2012
Weight: 596 KB
Category: Article
ISBN: 1467349437
DOI: 10.1109/EMAP.2012.6507882

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