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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices — Technology directions

✍ Scribed by Beyne, Eric

Book ID: 124158952
Publisher: IEEE
Year: 2012
Weight: 316 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3DIC.2012.6262977

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