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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Analysis of microbump induced stress effects in 3D stacked IC technologies

✍ Scribed by Ivankovic, A.; Van der Plas, G.; Moroz, V.; Choi, M.; Cherman, V.; Mercha, A.; Marchal, P.; Gonzalez, M.; Eneman, G.; Zhang, W.; Buisson, T.; Detalle, M.; Manna, A. L.; Verkest, D.; Beyer, G.; Beyne, E.; Vandevelde, B.; De Wolf, I.; Vandepitte, D.

Book ID: 118220331
Publisher: IEEE
Year: 2012
Weight: 765 KB
Category: Article
ISBN: 1467321885
DOI: 10.1109/3dic.2012.6262972

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