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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Architectural evaluation of 3D stacked RRAM caches

✍ Scribed by Lewis, Dean L.; Lee, Hsien-Hsin S.

Book ID: 115535643
Publisher: IEEE
Year: 2009
Weight: 609 KB
Volume: 0
Category: Article
ISBN: 1424445116
DOI: 10.1109/3dic.2009.5306582

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